While designers spend lot of time and effort on performance optimization of the ASIC, chip assembly and interconnect take a back seat. That's a pity, since the entire awesome chip performance must propagate through the interconnects and relies on the assembly. This is why Micram design methodology considers interconnect and assembly by adequate simulation models already during concept and design. In addition, Rapid!Prototyping and Test&Measurement are working hand in hand to provide those models and validate design performance. This in-house combination of Rapid!Prototyping, Test&Measurement and design services, yields short optimization cycles because board and chip designers are working hand in hand on site. Depending on the requirements, turnaround times below five days including RF layout design are standard.
Micram's Rapid!Prototyping is understood as interconnect technology at the interface between the high-performance chip and surrounding application. In particular, this can be just a simple PCB board with a standard package but also a high-speed MCM (Multi-Chip-Module) with multiple chips operating at 100 Gbit/s.
Rapid!Prototyping services are e.g. applied for production of
- Prototype assemblies,
- Evaluation boards,
- Golden devices,
- Test fixtures for parameter extraction,
- Deembedding and reference structures,
- Test and measurement accessories (e.g. amplifiers, frequency dividers...),
which are used for evaluation, characterization, parameter extraction and root cause of failure analysis. A short overview on technical details and some Rapid!Prototyping examples can be found on the following pages.
Micram's Rapid!Prototyping is offered in conjunction with any MICRAM turnkey ASIC development as well as a separate complementary customer service. For more information on Rapid!Prototyping, please contact your Micram sales representative.
