Micram

Design&Engineering services are tailored to provide one-stop turnkey ASIC solutions. Development flow activities herein are structured into design related services at the front-end as well as manufacturing and test related services at the back-end. Needless to say that any service is also individually available to our customers.

Design&Engineering services start at an early stage of the product development when there is just a product idea as a base for the ASIC Definition.

As an independent service provider Micram selects the best and most economical technology for the ASIC by a specific Technology Evaluation. Based on the chosen technology and the ASIC Definition, a Feasibility Study leads to a detailed specification not just for the ASIC but for the entire development (e.g. test, package, qualification...). In order to gain high speed and performance, even sophisticated state-of-the-art design flows need to be improved by application specific Design Tools introduced in the ASIC Design. In parallel, Package Design and Test Development are started to ensure the requirements of tough time schedules and matching design objectives.

For the backend services, already during design and after tape out Micram takes care about the Technology Run at the foundry and covers all verification and yield issues once the ASIC comes out of the fab. In the back-end processing Micram Design&Engineering participates in Wafer Test as well as in Assembly and Module Test.

In addition, all Design&Engineering activities are enhanced by Rapid!Prototyping, Test&Measurement as well as Supply Chain Management services.